ASML launches high technology for more advanced chips

ASML will launch its new high lithography machine, allowing smaller and more powerful chips. Intel will be the first to receive it and revolutionize global production

ASML is about to transform the scenario of semiconductor production with the introduction of its high -opening lithography machines (NA), especially Twinscan Exe: 5200. This state -of -the -art technology, which has a numerical opening of 0.55 compared to the traditional 0.33, enables 1.7 times smaller transistors and an increase in packing density 2.9 times, allowing the manufacture of more powerful chips .

According to IO Plus, scheduled to be launched in early 2025, EXE: 5200 will be delivered for the first time to the installation of Intel on Oregon, marking a significant leap in chip manufacturing capabilities. This development is crucial as technology promises advances aligned with Moore’s law, an essential guideline to maintain the competitive advantage of Intel, TSMC and Samsung in the global market. In addition to 2025, ASML plans to further improve these capabilities with hyper-na technology. The logistics feat involved in the delivery of this technology, which requires extensive transportation resources, reinforces its complexity and importance.

Impact on industry and market dynamics

The implementation schedule varies between the main semiconductor manufacturers. Intel leads the adoption curve, planning to integrate technology into its 14th process, with mass production scheduled for 2025-2026. TSMC, which holds 61.7% of global market share, should follow shortly afterwards, incorporating technology into the production of 2 nm nodes. Samsung has also shown great interest in technology, especially as the industry sails for complex market dynamics and the growing demand for advanced chip manufacturing capabilities.

Future trajectory and financial perspectives

ASML’s commitment to innovation goes beyond current high technology. The company has been developing this technology since 2014 and has been considering future EUV hyper-na machines with a 0.75 numerical opening, which can become particularly relevant around 2031 with the introduction of complementary field effect transistors (FETs ). Financially, ASML projects robust growth, with expected total net sales to 2025 between € 30 billion and € 35 billion, reflecting the growing demand for its advanced lithography solutions.

Logistics and implementation challenges

The implementation of these sophisticated machines has significant logistics challenges. Each system requires more than 250 transport boxes, multiple cargo aircraft and 20 semi-trailers distributed in 43 charging containers for delivery. Implementation requires more rigorous patterns for clean room environments and greater component manufacturing accuracy, highlighting the complexity of advancing in semiconductor manufacturing capabilities.